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  • Nov 24, 2015ASE Receives 2015 Taiwan Corporate Sustainability Awards
  • Oct 23, 2015ASE Water Recycling Plant Marks First Milestone
  • Oct 20, 2015ASE goes Green with the completion of an Ecological Walkway at Nantze Export Processing Zone in Kaohsiung
  • Oct 05, 2015An Open Letter to SPIL Shareholders from ASE (No. 3)
  • Oct 01, 2015An Open Letter to SPIL Shareholders from ASE (No. 2)
  • Sep 29, 2015Taiwan High Court Kaohsiung Branch Clears ASE and the Company's Employees from Charges Related to the Violation of the Waste Disposal Act
  • Sep 28, 2015An Open Letter to SPIL Shareholders from ASE (No. 1)
  • Sep 16, 2015ASE Chairman Jason Chang donates NTD5 million to combat Dengue outbreak
  • Sep 10, 2015ROC Tender Offer for Common Shares of SPIL at NT$45 Per Common Share by ASE - Q&A
  • Sep 04, 2015SiliCom: Exclusive Interview with Mr Jason Chang, Chairman of ASE Group
  • Sep 04, 2015ASE Chairman Jason Chang Receives SEMI Award for Achievements in the Advancement of Copper Wire Bonding Technology
  • Sep 04, 2015ASE announces signing ceremony with TDK on the inauguration of ASE Embedded Electronics Incorporated
  • Jul 29, 2015ASE receives prestigious International Trade Award from the Ministry of Economic Affairs
  • May 29, 2015ASE to Showcase System-in-Package Applications at Computex 2015
  • May 08, 2015ASE and TDK Announce Plans for a Joint Venture Agreement to Manufacture Embedded Substrates
  • Apr 09, 2015ASE Hosts Annual Supplier Awards Ceremony in Honor of Its Network of Partners
  • Feb 26, 2015Advanced Semiconductor Engineering (ASE) Joins the Electronic Industry Citizenship Coalition (EICC)
  • Jan 21, 2015Chairman of the ASE Group Donated NTD3,000,000 to Firefighters of the Fire Accident in Taoyuan County, Taiwan
  • Jan 15, 2015ASE Honored with SEMI Award for Advancement in Copper Wire Bonding Technology
  • Jan 14, 2015ASE's inaugural Green Bond awarded Country Deals of the Year 2014 by Asiamoney
  • Dec 23, 2014A Letter to ASE Employees from Chairman
  • Dec 18, 2014ASE Receives 2014 BSI GRC Exemplary Award
  • Sep 24, 2014ASE Listed in Channel NewsAsia Sustainability Ranking for Asia's Top Businesses
  • Aug 29, 2014ASE Makes the List on Forbes Asia Fabulous 50 Companies 2014
  • Aug 26, 2014ASE Collaborates on Leading MEMS Device with Bosch Sensortec GmbH
  • Aug 04, 2014ASE Kunshan Facility - Production Lines Continue Operation Normally
  • Aug 04, 2014ASE Kaohsiung Facility - Production Lines Continue Operation Normally
  • Mar 07, 2014ASE Honors Suppliers at Its Annual Supplier Day
  • Nov 07, 2013ASE Announces Joint Development and Production Collaboration with Infineon for Assembly of Automotive Products
  • Sep 30, 2013ASE Receives 2012 Best Supplier Award from NXP
  • Apr 12, 2013ASE Breaks Ground for New Factory Buildings in Kaohsiung
  • May 29, 2012ASE Announces the Opening of Its Weihai Phase 3 Manufacturing Facility
  • Oct 26, 2011ASE Awarded MOEA's First 'Taiwan Green Classic Award' for IC Packaging
  • Oct 23, 2011ASE Expands IC Assembly and Test Manufacturing Facilities in Taiwan
  • Sep 21, 2011ASE Officiates Groundbreaking Ceremony for its Shanghai
  • Jun 10, 2011ASE Rises To The Top Of The List In The 2011 Asia/Taiwan Info Tech 100 Enterprises
  • May 26, 2010ASE Concludes Groundbreaking Ceremony for a New Manufacturing Plant
  • Sep 18, 2009TSMC And ASE Lead Industry in Completing World's First Integrated Circuit Product Category Rule
  • Oct 15, 2008Spansion® and ASE Sign Final Manufacturing Joint Venture MOU
  • Aug 06, 2008ASE Honored by Vitesse
  • Jun 17, 2008ASE Packages One Billion Bluetooth Devices for CSR
  • Feb 20, 2008ASE Receives Supplier of the Year Award from Broadcom
  • Sep 28, 2007ASE Group and NXP Semiconductors Embark on a New Assembly and Test Joint Venture in Suzhou, China
  • Sep 06, 2007ASE and Mitsui Sign Cross-licensing Agreement
  • Mar 20, 2007ASE Selected by Qimonda for Substrate Supplier Partnership
  • Aug 29, 2006ASE Selected by Medtronic to Package its Sophisticated Integrated Circuits for Medical Devices
  • May 03, 2006ASE Innovates at SemiTech Taipei 2006
  • Dec 09, 2005ASE Receives Strategic Supplier Recognition From Agere Systems
  • Nov 01, 2005ASE SPONSORS 2005 FSA SUPPLIERS EXPO TAIWAN AND SEMICONDUCTOR LEADERS FORUM
  • Sep 27, 2005ASE SPONSORS 2005 FSA SUPPLIERS EXPO AND CONFERENCE
  • Aug 30, 2005Freescale Honors ASE with 2005 Supplier Recognition Award
  • Jun 30, 2005ASE Receives Supplier of the Year Award from Vitesse Semiconductor
  • May 24, 2005ASE Announces Milestone Shipment of 100 Million Bluetooth Chips
  • May 02, 2005ADVANCED SEMICONDUCTOR ENGINEERING, INC.
  • May 01, 2005ADVANCED SEMICONDUCTOR ENGINEERING, INC. PRESS RELEASE
  • Apr 28, 2005ASE and FlipChip International Sign Worldwide Licensing Agreement
  • Nov 10, 2004ASE GROUP SPONSORS 2004 FSA SUPPLIERS EXPO TAIWAN
  • Sep 22, 2004ASE Group sponsors 2004 FSA Suppliers Expo and Technical Conference
  • Jul 12, 2004ASE Group Celebrates 20th Anniversary
  • Jul 01, 2004ASE Ranked Amongst Business Week's INFO TECH 100 List
  • Jun 02, 2004Advanced Semiconductor Engineering, Inc.
  • Mar 30, 2004Nordic VLSI Addresses Environmental Concerns with ASE's Green QFN Package
  • Feb 25, 2004Conexant Recognizes ASE with 2003 Supplier of the Year Award
  • Feb 03, 2004ASE to Acquire IC Packaging and Testing Operation from NEC Electronics
  • Dec 17, 2003ASE Develops Packaging Solutions for austriamicrosystems' Secure Wireless Communication Device to be
  • Dec 11, 2003ASE Receives 2003 Strategic Awards from Agere Systems
  • Oct 28, 2003Group Affiliates ASE (Chung-Li) Inc. and ASE Material Inc. to Merge with ASE Inc.
  • Oct 28, 2003ASE and Compeq to set up IC Substrate Joint Venture
  • Oct 14, 2003ISE Labs Singapore renaming to ASE Singapore
  • Sep 03, 2003ASE Hosts Annual Technology Forum on Packaging and Test
  • Jul 23, 2003ASE Receives Raytheon Supplier Scorecard Award
  • Jul 08, 2003ASE Marks Volume Production Milestone on Wafer Level
  • Apr 16, 2003ASE qualifies wire-bond and flip-chip assemblies for ICs using TSMC's all-copper, 0.13-micron low-K
  • Apr 09, 2003ASE completes internal development of electroplated wafer bumping technology
  • Mar 27, 2003Silicon Laboratories and ASE announce milestone shipment of 10 million tested integrated circuits
  • Feb 24, 2003Altera Qualifies ASE's Lead-Free Packages
  • Feb 18, 2003ASE Announces Collaboration with AMD in Flip Chip Development for Chipset Assembly
  • Dec 11, 2002ASE Embarks on Volume Production of Image Sensor Packages
  • Nov 26, 2002ASE's Packaging Technology Enables Wireless Communication Chips from Leading European IC Design Hous
  • Nov 25, 2002ASE Receives Sub-contracting Supplier of the Year Award from Tower Semiconductor
  • Oct 29, 2002ASE Announces Volume Production Capability in 300mm Wafer Flip Chip Bumping
  • Oct 18, 2002ISE Labs and MuAnalysis Form Alliance to Enhance Analytical Test Services for the Canadian Semicondu
  • Jul 25, 2002ASE Advances in Fine Pitch Wire Bonding Technology
  • Jul 15, 2002ASE to Collaborate with IBM on Next Generation Flip Chip Packaging Technology
  • Jul 11, 2002ISE Offers Semiconductor Companies Worldwide Remote Access to Broad Range of Test Platforms
  • Jun 03, 2002ASE Hosts Third-Annual Tech Forum on Semiconductor Packaging and Test
  • May 24, 2002Announcement on the migration of email domain addresses to @aseglobal.com
  • Apr 08, 2002ASE and MTBS to jointly develop next generation Large Silicon Flip Chip Package
  • Mar 25, 2002ASE Named Assembly Supplier of the Year by Genesis Microchip
  • Mar 11, 2002ASE ranked No. 1 supplier in FSA's 2002 Wafer and Packaging Demand Survey
  • Feb 22, 2002ASE's fine pitch bonding technology accelerates CSR's BluetoothTM developments
  • Nov 20, 2001ASE pushes ahead with 300mm solder bumping technology
  • Oct 25, 2001ASE introduces Multi-Package Ball Grid Array Technology
  • Aug 14, 2001President Chen Visits ASE Kaohsiung Factory In Appreciation of ASE's Contribution to Taiwan's Semico
  • Jul 11, 2001TSMC, Motorola and ASE are First to Launch RosettaNet Supply Chain Software
  • Jul 11, 2001ASE Announces Its Success In Achieving the RosettaNet Work-In-Process Milestone
  • Jun 20, 2001ASE Named Supplier of the Year by Zoran Corporation
  • Jun 05, 2001VIA Unveils New 0.13 Micron Version VIA C3(tm) Processor at Computex Taipei 2001
  • May 31, 2001ASE first to offer world-leading SCSP and SiP package technologies
  • Mar 27, 2001ASE Inc receives Intel's Preferred Quality Supplier Award
  • Mar 06, 2001K&S Licenses Copper Ball Bonding Technology To Advanced Semiconductor Engineering
  • Feb 22, 2001ASE Unveils New Chip Manufacturing Technologies
  • Feb 20, 2001ASE AND CONEXANT TO EXCHANGE
  • Jan 19, 2001ASE Licenses Kulicke & Soffa's Flip Chip Bumping and Ultra CSP
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