Henkel's low-pressure molding Macromelt technology portfolio has recently been expanded to include a material designed specifically for high thermal stability and chemical resistance. The product, Macromelt MM6208, has all of the benefits consistent with Macromelt technology, but has a high Relative Temperature Index (RTI) rating of 95° C, making it ideal for certain automotive, consumer and appliance applications, where a very high RTI rating is required for good thermal stability.
Many applications, which require high thermal stability have been limited to potting processes. Now, with the development of a high RTI Macromelt formula, these applications can benefit from the proven processability and performance benefits of Macromelt MM6208. "Assembly specialists that have stringent thermal requirements are now no longer limited to the often messy and time-consuming potting process for component protection," explains Art Ackerman, Henkel Electronics Market Manager for Defense and Aerospace. "Not only does Macromelt MM6208 provide the thermal performance properties needed, but does so in a formula that streamlines the encapsulation process and protects even the finest-feature devices without risk of damage. This has the potential to dramatically improve assembly operations in several market sectors", says Ackerman in conclusion.
Reduced stress for sensitive electronic components
In fact, at 95°C, Macromelt MM6208 carries the highest RTI
rating in its class of materials, as the majority of hot
melt systems have RTIs of 65°C or less. Like all Macromelt
materials, the new product has been designed with superior
performance, device protection and ease-of-use at its core.
These unique materials are polyamide-based hot melt
formulas that can quickly over-mold, encapsulate and
protect exposed circuitry while simultaneously forming the
product's outer shell.
Once encapsulated, the product becomes a self-contained
integrated assembly. The Macromelt process uses an
exceptionally low application pressure of between 20 and
500 psi, which greatly reduces stress and damage for
sensitive electronic components and its very low modulus
and hardness make it well-suited for flexible applications.
With one of the lower melting point materials available,
Macromelt provides easier encapsulation of ceramics, wire
bonds and leaded solder joints.
Safety for consumer and applications
The Relative Temperature Index is a guarantee that an
insulating material will not thermally degrade under stress
of chemical, mechanical or electrical strain over the life
of the component. Having achieved an RTI rating of 95°C
from Underwriters Laboratory (UL), Macromelt MM6208 has
been established as a material that will not compromise the
functionality of the device or the safety of the consumer
for applications which require this level of thermal
stability.
Macromelt MM6208 is available in two different versions, Macromelt MM6208 in an amber color and Macromelt MM6208S in black. Both are 95°C RTI-rated. For more information on these or any of Henkel's Macromelt formulations, log onto www.henkel.com/electronics
Henkel AG & Co. KGaA
distributed by | This press release was issued by Henkel AG & Co. KGaA and was initially posted at http://www.henkel.com. It was distributed, unedited and unaltered, by noodls on 2012-03-16 11:55:04 AM. The issuer is solely responsible for the accuracy of the information contained therein. |