We have launched our extended portfolio of automotive power MOSFETs in LFPAK56D. Packing even more into the Power-SO8 footprint, the LFPAK56D fits two MOSFETs into one robust package where performance isn't compromised. Fully AEC-Q101 qualified to 175 °C the latest MOSFET offering broadens the LFPAK56D portfolio to include 9 new devices across a range of voltages. LFPAK56D designers can reduce the footprint size per MOSFET channel by 77% compared to DPAK and 56% compared to LFPAK56.

Key features

  • Wire bond free - Cu clip design
  • High ID max rating
  • Low package resistance and inductance
  • Low thermal resistance
  • Footprint compatible with other Power-S08 packages
  • High current transient robustness
  • 100% avalanche tested
  • Extensive product range

Target applications

  • Engine and transmission controllers
  • Braking solenoid and motor drives
  • General-purpose automotive switching where space is at a premium
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