By a News Reporter-Staff News Editor at Journal of Engineering -- From Alexandria, Virginia, VerticalNews journalists report that a patent by the inventors Kocurek, Patrick J. (Allen, TX); Schlieter, Daniel (Richardson, TX); Loehrlein, Christopher (Plano, TX); Pillans, Brandon W. (Plano, TX); Pierce, Richard G. (Richardson, TX), filed on August 4, 2015, was published online on October 10, 2017.
The patent's assignee for patent number 9786975 is RAYTHEON COMPANY (Waltham, MA).
News editors obtained the following quote from the background information supplied by the inventors: "The present invention relates to a 3D printed transmission line assembly and, more specifically, to a 3D printed radio frequency (RF) transmission line assembly.
"High RF loss from conventional transmission lines, such as microstrip transmission lines, striplines and coplanar waveguide (CPW) transmission lines, leads to limits on RF power that can be transmitted along conventional transmission lines. This is especially true for those transmission lines used for the transmission of high frequency signals. Due to the RF losses, conventional transmission lines must be spaced relatively far apart to ensure RF isolation from one line to another. This spacing requirement results in RF crossover assemblies requiring expensive, multilayer boards.
"With the above in mind, it is seen that large scale broadband performance is often limited by the use of conventional transmission lines. As an attempt to address the problems associated with conventional transmission lines, a polystrata process was proposed and demonstrated high-isolation RF crossovers with very low loss. However, since the process relies upon subtractive manufacturing with many operational steps, the process is prohibitively expensive and difficult to integrate into some RF products."
As a supplement to the background information on this patent, VerticalNews correspondents also obtained the inventors' summary information for this patent: "According to one embodiment of the present invention, a transmission line is provided and includes a center conductor suspended above a ground plane and comprising a line of printed, self-supporting metallic material, ground walls disposed on either side of the center conductor and comprising stacked lines of printed metallic material and a lid suspended above the center conductor between the ground walls and comprising arrayed lines of the printed, self-supporting metallic material.
"According to another embodiment of the present invention, a transmission line formation method is provided and includes suspending a first line of self-supporting metallic material (SSMM) above a ground plane, laying first and second lines of grounded metallic material (GMM) along the ground plane on either side of the first line, forming ground walls by laying additional lines of metallic material (AMM) on the first and second lines of the GMM and on previously laid lines of the AMM and forming a lid by suspending second lines of the SSMM above a plane of the first line of the SSMM.
"According to another embodiment of the present invention, a transmission line formation method is provided and includes printing a first line of self-supporting metallic material (SSMM) above a ground plane between first and second removable supports, printing first and second lines of grounded metallic material (GMM) along the ground plane on either side of the first line of the SSMM, sequentially forming ground walls by printing lines of additional metallic material (AMM) on the first and second lines of the GMM and on previously printed lines of the AMM in a stacking direction and sequentially forming a lid by printing second lines of the SSMM above a plane of the first line of the SSMM between respective uppermost lines of the AMM of the ground walls.
"Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention. For a better understanding of the invention with the advantages and the features, refer to the description and to the drawings."
For additional information on this patent, see: Kocurek, Patrick J.; Schlieter, Daniel; Loehrlein, Christopher; Pillans, Brandon W.; Pierce, Richard G.. Transmission Line Formed of Printed Self-Supporting Metallic Material. U.S. Patent Number 9786975, filed August 4, 2015, and published online on October 10, 2017. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9786975.PN.&OS=PN/9786975RS=PN/9786975
Keywords for this news article include: RAYTHEON COMPANY.
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