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Samsung SDI : Patent Issued for Semiconductor Device for Protecting Battery Cell, Protection Circuit Module and Battery Pack Having the Same

05/20/2015 | 05:34pm US/Eastern

By a News Reporter-Staff News Editor at Electronics Newsweekly -- Samsung SDI Co., Ltd. (Yongin-si, KR) has been issued patent number 9028987, according to news reporting originating out of Alexandria, Virginia, by VerticalNews editors.

The patent's inventor is Kim, Bongyoung (Yongin-si, KR).

This patent was filed on November 16, 2010 and was published online on May 12, 2015.

From the background information supplied by the inventors, news correspondents obtained the following quote: "On or more embodiments of the present invention relate to a semiconductor device for protecting a battery cell, a protection circuit module, and a battery pack having the semiconductor device for protecting a battery cell.

"In general, lithium-based secondary batteries, such as lithium ion batteries or lithium polymer batteries, have higher energy densities and smaller weights than Pb storage batteries, Ni--Cd batteries, or Ni--H batteries. Thus, the lithium-based secondary batteries are widely used as power sources for portable electronic devices, such as notebook computers, mobile phones, personal digital assistants (PDAs), and other typical electronic devices.

"However, such lithium-based secondary batteries are unstable in chemical composition, and there is an increased risk of danger, such as leakage, explosion, fire, or the like due to malfunction, such as perforation, compression, external short, overcharge, overdischarge, heat, drop, or cutting. Thus, in order to protect the secondary battery from overcharge, overdischarge, or over-current, or prevent the secondary battery from deteriorating in its performance, a protection circuit module (PCM) may be mounted in the battery when fabricating a battery pack."

Supplementing the background information on this patent, VerticalNews reporters also obtained the inventor's summary information for this patent: "Aspects of embodiments of the present invention are directed to a semiconductor device for protecting a battery cell, a protection circuit module, and a battery pack using the protection circuit module, which achieve a compact sized battery pack by eliminating an overdischarge switch while increasing the integration density.

"Other aspects of embodiments of the present invention are directed to a semiconductor device for protecting a battery cell, a protection circuit module, and a battery pack using the protection circuit module, which can reduce the manufacturing cost by eliminating an unnecessary overdischarge switch from battery design.

"An embodiment of the present invention provides a semiconductor device including an integrated circuit configured to sense a voltage of a battery cell and to output a control signal, a charge switch electrically coupled to the integrated circuit and configured to interrupt a charge path according to the control signal output from the integrated circuit, a first lead electrically coupled to the integrated circuit, a second lead electrically coupled to the charge switch, and a sealing portion that seals the integrated circuit, charge switch, the a first lead, and the second lead.

"The integrated circuit and the charge switch may be coupled to each other by at least one conductive wire, the integrated circuit and the first lead may be coupled to each other by at least one conductive wire, and the charge switch and the second lead may be coupled to each other by at least one conductive wire.

"The first lead and the second lead may protrude outside the sealing portion. In addition, the at least one first lead may include a first sub lead for supplying power to the integrated circuit, and a second sub lead for supplying a voltage of the battery cell. Here, the first sub lead may be arranged at one side of the sealing portion, and the second sub lead and the second lead may be aligned with each other at the other side of the sealing portion facing the first sub lead. The first sub lead may be electrically coupled to a battery terminal and a pack terminal, and the second sub lead may be electrically coupled to the pack terminal. In addition, the second lead may be electrically coupled to the pack terminal.

"The sealing portion may include an integrated circuit mounting board and the integrated circuit may be mounted on the integrated circuit mounting board. The first mounting board may be coupled to the integrated circuit using an insulating adhesive. The sealing portion may include a charge switch mounting board and the charge switch may be mounted on the charge switch mounting board. The charge switch mounting board may be coupled to the charge switch using a conductive adhesive. The charge switch mounting board may protrude outside the sealing portion.

"The sealing portion may further include a dummy lead. The dummy lead may protrude outside the sealing portion. The dummy lead may be formed at the same side of the sealing portion as the first sub lead of the sealing portion.

"Another embodiment of the present invention provides a battery pack including a protection circuit module including the aforementioned semiconductor device, the semiconductor device being mounted on a printed circuit board, and a battery cell electrically coupled to the protection circuit module.

"The printed circuit board may further include a battery terminal electrically coupled to the battery cell, and a pack terminal electrically coupled to an external system.

"Additional aspects and/or advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention."

For the URL and additional information on this patent, see: Kim, Bongyoung. Semiconductor Device for Protecting Battery Cell, Protection Circuit Module and Battery Pack Having the Same. U.S. Patent Number 9028987, filed November 16, 2010, and published online on May 12, 2015. Patent URL: http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9028987.PN.&OS=PN/9028987RS=PN/9028987

Keywords for this news article include: Circuit Board, Semiconductor, Electronic Equipment Companies.

Our reports deliver fact-based news of research and discoveries from around the world. Copyright 2015, NewsRx LLC

(c) 2015 NewsRx LLC, source Technology Newsletters

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