By Targeted News Service
ALEXANDRIA, Va., June 24 -- STMicroelectronics, Coppell, Texas, International Business Machines, Armonk, New York, and Tokyo Electron, Tokyo, have been assigned a patent (9,373,582) developed by seven co-inventors for "self aligned via in integrated circuit." The co-inventors are Yannick Feurprier, Watervliet, New York, Joe Lee, Albany, New York, Lars W. Liebmann, Poughquag, New York, Yann Mignot, Slingerlands, New York, Terry A. Spooner, Clifton Park, New York, Douglas M. Trickett, Altamont, New York, and Mehmet Yilmaz, Ankara, Turkey.
The patent application was filed on June 24, 2015 (14/749,140). The full-text of the patent can be found at http://patft.uspto.gov/netacgi/nph-Parser?Sect1=PTO1&Sect2=HITOFF&d=PALL&p=1&u=%2Fnetahtml%2FPTO%2Fsrchnum.htm&r=1&f=G&l=50&s1=9373582.PN.&OS=PN/9373582&RS=PN/9373582
Written by Deviprasad Jena; edited by Jaya Anand.
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