Daniel Giesecke

Daniel Giesecke

Chief Operating Officer at KNOWLES CORPORATION

Net worth: 2 M $ as of 2024-03-30

56 year
Electronic Technology
Consumer Services
Commercial Services

Profile

Daniel J.
Giesecke
is currently the Director at Knowles Europe Ltd., a Member at The Institute of Electrical & Electronics Engineers, Inc., and a Member at International Microelectronics & Packaging Society.
He was previously the Chief Operating Officer & Senior Vice President at Knowles Corp.
and held former positions as Director at Audience, Inc., Vice President-Advanced Manufacturing Engineering at Knowles Electronics LLC, and Vice President-Global Operations at Dover Fueling Solutions Segment, Inc. Giesecke received his undergraduate degree from Northern Illinois University and his graduate degrees from Northern Illinois University and Northwestern University.

Known holdings in public companies

CompanyDateNumber of sharesValuationValuation date
2024-03-07 97,832 ( 0.11% ) 2 M $ 2024-03-30

Daniel Giesecke active positions

CompaniesPositionStart
KNOWLES CORPORATION Chief Operating Officer 2014-01-31
Corporate Officer/Principal -
International Microelectronics & Packaging Society Corporate Officer/Principal -
Director/Board Member 2015-02-18
All active positions of Daniel Giesecke

Former positions of Daniel Giesecke

CompaniesPositionEnd
Chief Operating Officer 2014-01-31
Corporate Officer/Principal 2012-10-31
AUDIENCE INC Director/Board Member -
See the detail of Daniel Giesecke's experience

Training of Daniel Giesecke

Northwestern University Graduate Degree
Northern Illinois University Graduate Degree

Experiences
Positions held

Active

Inactive

Listed companies

Private companies

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Connections

100 +

1st degree connections

9

1st degree companies

Male

Female

Members of the board

Executives

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Linked companies

Listed companies1
KNOWLES CORPORATION

Electronic Technology

Private companies6

Electronic Technology

Health Technology

Commercial Services

Industrial Services

Commercial Services

International Microelectronics & Packaging Society

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