Wen Feng Cheng
Director/Board Member at SYSTEX CORPORATION
Profile
Wen Feng Cheng is an Independent Director at Chipbond Technology Corp.
and Systex Corp.
He is also a Director at Evest Corp.
and Chipboard Technology Corp.
Previously, he served as the Chairman, General Manager & Spokesman at BoardTek Electronics Corp.
and as a Director at Uniflex Technology, Inc. He graduated from National Tsing-Hua University.
Wen Feng Cheng active positions
Companies | Position | Start |
---|---|---|
SYSTEX CORPORATION | Director/Board Member | 2013-06-20 |
CHIPBOND TECHNOLOGY CORPORATION | Director/Board Member | 2019-06-13 |
Chipboard Technology Corp.
Chipboard Technology Corp. Electronic Production EquipmentElectronic Technology Chipboard Technology Corp. engages in the provision of surface treatment production process services. It provides gold finger plating, chemical silver, electroplated soft gold, and electroplated nickel gold services. The company was founded on January 30, 1999 and is headquartered in Taoyuan, Taiwan. | Director/Board Member | - |
Evest Corp.
Evest Corp. Industrial MachineryProducer Manufacturing Evest Corp. researches, develops, manufactures, and sales automated manufacturing and packaging solutions. It services include mechanical design, software engineering, vision technology, electric controlling, and related system integration. The firm specializes in analyzing the emerging production processes among a variety of segments, tailoring solutions in addressing customers requirements, and consulting customers in improving their plant operation efficiency. The company was founded in 1999 and is headquartered in Taoyuan City, Taiwan. | Director/Board Member | - |
Former positions of Wen Feng Cheng
Companies | Position | End |
---|---|---|
UNIFLEX TECHNOLOGY INC. | Director/Board Member | - |
BOARDTEK ELECTRONICS CORP | Chief Executive Officer | - |
Training of Wen Feng Cheng
National Tsing-Hua University | Graduate Degree |
Experiences
Positions held
Connections
1st degree connections
1st degree companies
Male
Female
Members of the board
Executives
Linked companies
Listed companies | 3 |
---|---|
CHIPBOND TECHNOLOGY CORPORATION | Electronic Technology |
UNIFLEX TECHNOLOGY INC. | Electronic Technology |
SYSTEX CORPORATION | Technology Services |
Private companies | 3 |
---|---|
BoardTek Electronics Corp.
BoardTek Electronics Corp. Electronic ComponentsElectronic Technology BoardTek Electronics Corp. engages in the design, manufacture, and sale of multilayer PCB, single & double-sided PCB, and electronic components. Its products include PCB products, integrated circuit (IC) substrate, and green process and system integration. The PCB products cover high speed digital PCB, high frequency microwave PCB, pre-bond metal PCB, post-bonding metal PCB, coin insertion and embedding, ceramic substrate embedded PCB, and heavy copper PCB. The IC substrate covers flash and memory card substrate, complementary metal-oxide semiconductor (CMOS) image sensor substrate, and light-emitting diode (LED) Substrate. The green process and system integration covers high purity copper oxide, copper concentration control system, and insoluble anode. BoardTek Electronics was founded on June 8, 1987 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
Evest Corp.
Evest Corp. Industrial MachineryProducer Manufacturing Evest Corp. researches, develops, manufactures, and sales automated manufacturing and packaging solutions. It services include mechanical design, software engineering, vision technology, electric controlling, and related system integration. The firm specializes in analyzing the emerging production processes among a variety of segments, tailoring solutions in addressing customers requirements, and consulting customers in improving their plant operation efficiency. The company was founded in 1999 and is headquartered in Taoyuan City, Taiwan. | Producer Manufacturing |
Chipboard Technology Corp.
Chipboard Technology Corp. Electronic Production EquipmentElectronic Technology Chipboard Technology Corp. engages in the provision of surface treatment production process services. It provides gold finger plating, chemical silver, electroplated soft gold, and electroplated nickel gold services. The company was founded on January 30, 1999 and is headquartered in Taoyuan, Taiwan. | Electronic Technology |
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