Aehr Test Systems announced that it will be showcasing its FOX-XP next generation multi-wafer test and burn-in systems for high volume production and early failure rate (EFR) test in booth 5381 at SEMICON West 2018, taking place July 10-12 at the Moscone Convention Center in San Francisco, California. The solutions Aehr Test will feature at its SEMICON West exhibit booth include: The FOX-XP system, the company’s next-generation multi-wafer and now singulated die/module test solution that is capable of functional test and burn-in/cycling of flash memories, microcontrollers, sensors, and other ICs in wafer form before they are assembled into single or multi-die stacked packages. The FOX wafer-level systems utilize Aehr Test's FOX WaferPakTM contactors, which provide cost effective solutions for making electrical contact with a full wafer or substrate in a multi-wafer environment. The new configuration with the DiePak Carriers also enables burn-in of singulated die and multi-die modules to screen for defects in both the die and the module assembly process. The resulting known-good die or single-die or stacked-die packaged parts can then be used for high reliability and quality applications such as enterprise solid state drives, automotive devices, highly valuable mobile applications, and mission critical integrated circuits and sensors. The FOX-1PTM system, Aehr Test’s second generation of its single-wafer FOX-1 platform originally introduced in 2006, which has proven to be a cost saving high-volume production solution for single touchdown 300mm full-wafer parallel test. The new FOX-1P system can be configured with over 16,000 “Universal Channels” and features a massively parallel test interface, which enables testing over a thousand die in a single touchdown. The ABTSTM family of packaged part burn-in and test systems, which is based on a hardware and software platform that is designed to address not only today’s devices, but also future devices for many years to come. This system can test and burn-in high pin-count devices and there are also configurations for both high-power and low-power applications. The key features of the FOX-XP test cell that contribute to the cost-effectiveness of the solution include the ability to provide up to 2,048 Universal Channels per wafer or DiePak carrier, which allows the system to test all the devices on the wafer or DiePak carrier in parallel. The innovative Universal Channel architecture allows any channel to be any function (I/O, Device Power Supply (DPS) or Per-pin Precision Measurement Unit (PPMU)). This enhanced architecture now allows customers to perform per pin parametric testing, more extensive digital pattern test with deeper data stimulus /capture memory (32M per pin), and deeper scan (768M) optimized for BIST/DFT testing. A single FOX-XP test system may be configured with up to 18 slots of test resources enabling up to 18 wafers to be tested simultaneously. It also includes Aehr’s proprietary WaferPak full wafer contactor or DiePak carrier, which enables meeting the very high pin count and small pad size and pad pitch requirements of today’s devices, and Aehr’s high performance thermal chucks that enable managing the temperature of the high power density of the devices under test. The footprint of the 18-slot test system is similar to the footprint of typical semiconductor Automatic Test Equipment (ATE) that can only test one wafer at a time. With the highest wafer throughput available in the ATE industry, the flexibility of Aehr Test’s new “Universal Channel” architecture, and the ability to perform both functional pattern verification and parametric testing at full-wafer parallel test, the FOX-XP system provides a highly differentiated solution from competitive alternatives.