The Company's 2022Q2 consolidated financial
statements have been approved by the Board
of Directors
Date of events
2022/07/29
To which item it meets
paragraph 31
Statement
1.Date of submission to the board of directors or approval by the board of
directors:2022/07/29
2.Date of approval by the audit committee:2022/7/29
3.Start and end dates of financial reports or annual self-assessed financial
information of the reporting period (XXXX/XX/XX~XXXX/XX/XX):
2022/01/01~2022/06/30
4.Operating revenue accumulated from 1/1 to end of the period
(thousand NTD):3,083,378
5.Gross profit (loss) from operations accumulated from 1/1 to end of
the period (thousand NTD):1,351,485
6.Net operating income (loss) accumulated from 1/1 to end of the period
(thousand NTD):992,699
7.Profit (loss) before tax accumulated from 1/1 to end of the period
(thousand NTD):1,500,543
8.Profit (loss) accumulated from 1/1 to end of the period
(thousand NTD):1,179,140
9.Profit (loss) during the period attributable to owners of parent
accumulated from 1/1 to end of the period (thousand NTD):1,179,140
10.Basic earnings (loss) per share accumulated from 1/1 to end of
the period (NTD):7.38
11.Total assets end of the period (thousand NTD):12,473,075
12.Total liabilities end of the period
(thousand NTD):2,287,929
13.Equity attributable to owners of parent end of the
period (thousand NTD):10,185,146
14.Any other matters that need to be specified:
The Company's non-operating income and expenses mainly are foreign exchange
gains resulting from the evaluation of the foreign-currency net positions
based on the exchange rate at the end of the reporting period.
The foreign-currency position includes the unused GDR amounts issued
in January 2022.
Attachments
Original Link
Original Document
Permalink
Disclaimer
AP Memory Technology Corporation published this content on 29 July 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 29 July 2022 15:02:08 UTC.
AP Memory Technology Corp. is engaged in the development, design, manufacture and sale of memory Integrated Circuits (ICs). The Companyâs products include customized low density PSRAM (Pseudo-SRAM) and medium density joint electron device engineering council (JEDEC) standard low-power dynamic random access memory (DRAM). The Company provides Mobile RAM KGD (Know-Good-Die) solutions to mobile communication processor SiP (System-in-Package), non-volatile memory MCP (Multi-Chip-Package) and other applications.