Chinlink International : ISSUE OF FIRST TRANCHE OF BONDS DUE 2021 IN PRINCIPAL AMOUNT OF HK$66.5 MILLION

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CHINLINK INTERNATIONAL HOLDINGS LIMITED

普 匯 中 金 國 際 控 股 有 限 公 司*

(Incorporated in Bermuda with limited liability)

(Stock code: 0997)

ISSUE OF FIRST TRANCHE OF BONDS DUE 2021

IN PRINCIPAL AMOUNT OF HK$66.5 MILLION

Placing Agent

Reference is made to the announcement of Chinlink International Holdings Limited (the "Company") dated 23 July 2020 (the "Announcement") in relation to the placing of 6.5% coupon secured bonds up to the aggregate principal amount of HK$100 million (the "Bonds") due 2021. Unless otherwise defined, capitalised terms used herein shall have the same meanings as those defined in the Announcement.

The Board is pleased to announce that the first tranche of Bonds in principal amount of HK$66.5 million (the "First Tranche Bonds") was issued on 4 August 2020, pursuant to the terms and conditions of the Placing Agreement. The First Tranche Bonds will mature on the first anniversary of the date of issue.

Pursuant to the Placing Agreement, the Placing Period will expire on 22 September 2020 (or such other date as the Placing Agent and the Company may agree in writing) and the Bonds may be issued in multiple tranches. Further announcement(s) will be made by the Company in relation to the issue of any further tranche(s) of the Bonds as and when appropriate.

By order of the Board

Chinlink International Holdings Limited

Mr. Li Weibin

Chairman

Hong Kong, 4 August 2020

As at the date of this announcement, the Board comprises three executive Directors, namely Mr. Li Weibin, Mr. Siu Wai Yip and Mr. Lau Chi Kit; a non-executive Director, namely Ms. Fung Sau Mui; and three independent non-executive Directors, namely Dr. Ho Chung Tai, Raymond, Ms. Lai Ka Fung, May and Ms. Chan Sim Ling, Irene.

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