Chipbond Technology Corporation Announces Cash Dividend Payable on August 13, 2021

Chipbond Technology Corp is a Taiwan-based company principally engaged in the research, development, manufacture, and distribution of electronic and semiconductor products, as well as the provision of related testing and assembling services. The Company provides products include gold bumps, solder bumps, chip on glass (COG), chip on film (COF) and flip chip and tape carrier packaging (TCP) products, among others. Its products are mainly used in the manufacture of computers, workstations, mobile phones, network products, air bag controllers, engine controlling components, automatic brake systems (ABSs), automobile air conditioners, digital cameras, watches, and liquid crystal display (LCD) monitors. The Company mainly distributes its products in Taiwan, the United States of America (the USA) and other regions.