Chipbond Technology Corporation announced a private placement of 4,462,000 common shares at a price of TWD 67.43 per share to returning investor Hua Chen Investment Co., Ltd for gross proceeds of TWD 300,880,000 on July 15, 2022. After completion of the transaction, Hua Chen Investment Co., Ltd will hold 8,910,000 shares worth TWD 606,009,000 in the company representing 1.21% stake.
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- Chipbond Technology Corporation announced that it expects to receive TWD 300.87266 million in funding from Hua Chen Investment Co., Ltd