Dongguan Darbond YizTech Materials Co., Ltd. announced that it will receive CNY 46,938,776 in an equity round of funding on March 20, 2023. The transaction will include participation from Darbond Technology Co., Ltd for CNY 23,938,776 and YizTech Co., Ltd for CNY 23,000,000. Post the closing, the regisrted capital of the company will increase from CNY 4,608,440.90 to CNY 51,547,216.90.

The transaction has been approved at the 14th meeting of the first board of directors and eighth meeting of the first board of supervisors.