INTEGRAL TECHNOLOGIES, INC. Integral Technologies, Inc. and ElectriPlast Corp. announced exciting development of two new materials. These materials keep Integral well in front of the industry performance curve.
The focus of these new materials is the high performance shielding market and applications that will utilize ElectriPlast as a conductor. These new products will be protected by existing patents, with additional opportunities to add to Integral's IP portfolio from innovations achieved during product development. The first material is a lightweight, high strength conductive material with an inner core of un-plated 12K and 24K carbon fiber, the second material is a highly conductive material using copper plated carbon fiber ('CuC').
Both materials can be formulated with most base resins, including ABS, PA66, PBT, PC, and PP. Technical information will be made available on the new materials in the next few weeks, at which time orders will be accepted for them.
