Jiangsu Asia-Pacific Linglv Technology Development Co., Ltd. announced that it will raise CNY 480,000,000 in an equity round of funding from returning investor Jiangsu Asia-Pacific Light Alloy Technology Co., Ltd. on April 29, 2023. The company's registered capital will increase from CNY 100,000,000 to CNY 580,000,000. The transaction has been approved in the 10th meeting of the 6th directorate.
End-of-day quote
Other stock markets
|
5-day change | 1st Jan Change | ||
6.41 CNY | +0.63% | +2.40% | -3.03% |
EPS Revisions
Annual profits - Rate of surprise
1st Jan change | Capi. | |
---|---|---|
-3.03% | 1.09B | |
+3.84% | 17.24B | |
+35.90% | 16.21B | |
+2.43% | 12.82B | |
+31.90% | 6.75B | |
+9.47% | 6.6B | |
+49.33% | 6.53B | |
-.--% | 5.94B | |
+38.73% | 4.08B | |
+21.06% | 3.56B |
- Stock Market
- Equities
- 002540 Stock
- News Jiangsu Asia-Pacific Light Alloy Technology Co., Ltd.
- Jiangsu Asia-Pacific Linglv Technology Development Co., Ltd. announced that it expects to receive CNY 480 million in funding from Jiangsu Asia-Pacific Light Alloy Technology Co., Ltd.