Inactive Instrument

Lite-On Semiconductor Corp.

Equities

5305

TW0005305007

Lite-On Semiconductor Corp. Announces Adjustment of Dividend Payout Ratio from 2017 Earnings

July 04, 2018 at 03:04 am EDT

Lite-On Semiconductor Corp. announced dividend distribution after the adjustment TWD 498,449,901 or TWD 1.59702158 per share. Due to the execution of employee options, the Company's total outstanding shares increased to 312,112,188 shares. As per resolution of June 15th shareholders' meeting, any buy back shares or, conversion, transfer or write off or execution of employee options which resulted to a change in total circulated shares, the Chairman is authorized to adjust the dividend payout ratio accordingly.

Latest news about Lite-On Semiconductor Corp.

Lite-On Semiconductor Corp.(UNQ:5305) dropped from Taiwan TAIEX Index	20-12-08	CI
Diodes Incorporated completed the acquisition of Lite-On Semiconductor Corp. from Lite-On Capital Corporation and Lite-On Technology Corporation.	20-11-29	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Third Quarter Ended September 30, 2020	20-11-12	CI
Lite-On Semiconductor Corp.(TSEC:5305) dropped from S&P Global BMI Index	20-10-20	CI
Lite-On Semiconductor Corp. Announces Address Change	20-10-19	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Second Quarter Ended June 30, 2020	20-08-12	CI
Lite-On Semiconductor Corp. Declares Cash Dividend for the Year 2019	20-06-19	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the First Quarter Ended March 31, 2020	20-05-13	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Full Year Ended December 31, 2019	20-03-30	CI
A consortium comprising Pavilion Capital Pte. Ltd., Axiom Asia Private Capital and others entered into a merger agreement to acquire 83.5% stake in On-Bright Electronics Incorporated from Lite-On Semiconductor Corp. and others for TWD 10.8 billion.	20-01-07	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Third Quarter Ended September 30, 2019	19-11-12	CI
Lite-On Technology Corporation completed the acquisition of remaining 50.51% stake in Lite-On Japan Ltd.(JASDAQ:2703) from Silitech Technology Corporation, Lite-On Semiconductor Corp. and other sellers.	19-08-30	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the Second Quarter Ended June 30, 2019	19-08-12	CI
Diodes Incorporated entered into an agreement to acquire Lite-On Semiconductor Corp. for approximately TWD 2.7 billion.	19-08-07	CI
Lite-On Semiconductor Corp. Announces Cash Dividends for 2018	19-06-26	CI
Lite-On Semiconductor Corp. Declares Distribution for the Year 2018	19-06-18	CI
Lite-On Technology Corporation made an offer to acquire remaining 50.51% stake in Lite-On Japan Ltd.(JASDAQ:2703) from Silitech Technology Corporation, Lite-On Semiconductor Corp. and other sellers for ¥1.5 billion.	19-06-02	CI
Lite-On Semiconductor Corp. Reports Earnings Results for the First Quarter Ended March 31, 2019	19-05-13	CI
Lite-On Semiconductor Corp Reports Earnings Results for the Full Year Ended December 31, 2018	19-03-27	CI
Lite-On Semiconductor Corp Appoints Karin Huang as Corporate Governance Officer	19-03-20	CI
Lite-On Semiconductor Signs Franchise Distribution Agreement with New Yorker Electronics to Supply its Discrete Power Management Devices Around the World	19-01-30	CI
Lite-On Semiconductor Corp. Announces the Resignation of Albert Chang, Director of LSC	19-01-29	CI
Lite-On Semiconductor Corp. Reports Consolidated Earnings Results for the Third Quarter and Nine Months of 2018	18-11-09	CI
Lite-On Semiconductor Corp. Reports Consolidated Earnings Results for the Second Quarter and Six Months of 2018	18-08-10	CI
Lite-On Semiconductor Corp. Announces Adjustment of Dividend Payout Ratio from 2017 Earnings	18-07-04	CI

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Company Profile

Lite-on Semiconductor Corp. is a Taiwan-based company principally engaged in the design, manufacture and sale of semiconductor components. The Company mainly provides contact image sensor (CIS), integrated solution ICs, semiconductor components and wafer foundry services. The Company's integrated solution ICs includes integrated ambient lights, proximity sensor modules, infrared light emitting diode (LED) and others. The Company's semiconductor components include discrete, analog ICs, sensor ICs and others. The Company's products and services are mainly applied in the power supply of computer, communication and consumer electronic (3C), industrial, lighting, automobile and other industries. The Company distributes its products primarily in Asia, Europe and the Americas.

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