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Lite-On Semiconductor Corp.

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5305

TW0005305007

Lite On Semiconductor : LSC 2016 Q1 Operating Income grew 8 folds YoY

May 12, 2016 at 02:53 am EDT

(5/12/2016 Taipei News) LSC (TWSE:5305) held its board meeting today and approved the 1st quarter consolidated financial report, EPS amounted to NTD0.07. The 1st quarter sales was NTD2,348 Million, approximately 8% increased on a YoY basis. Operating income improved 8 folds on a YoY basis which could be attributed to a better product sales mix, a lower SGA and manufacturing cost down derived from improved automation.

Our four product groups experienced a growth in sales, gross profit and operating profit on a YoY basis. Even the 6 inch foundry and Modular system were profitable in the usually weak 1st quarter due to a better cost control and due to the penetration to the more profitable new ticketing application. The only setback was the 1st quarter loss from Diodes Inc. due to its inventory write off etc which resulted in a 93% decline YoY in our company's 1st quarter other income.

Q1 Consolidated Financial Report approved in the May 12th, 2016 BOD meeting, details as below:

項目Item		Year 2016年Q1	Year 2015年Q1

		金額Amount	金額Amount
		單位 Unit : 仟元 thousand	單位 Unit : 仟元 thousand
營業收入營業毛利	Revenue Gross profit	2,348,403 541,943	2,182,951 446,338
營業淨利稅前淨利	Operation profitProfit before tax	128,607 113,907	13,763 229,683
本期淨利	Net Profit	83,152	178,436
本期淨損益歸屬於本公司業主	Net Profit attributable to owner of the company	20,598	115,348
本期淨損益歸屬於非控制權益	Net profit atttributable to non controlling interests	62,554	63,088
每股盈餘(元)	Earnings per share (NTD)	NTD0.07	NTD0.36

Lite-On Semiconductor Corp. published this content on 12 May 2016 and is solely responsible for the information contained herein.
Distributed by Public, unedited and unaltered, on 12 May 2016 06:52:10 UTC.

Original documenthttp://www.liteon-semi.com/_en/12_news/02_newsdetail.php?MainID=1&ID=187

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Lite-on Semiconductor Corp. is a Taiwan-based company principally engaged in the design, manufacture and sale of semiconductor components. The Company mainly provides contact image sensor (CIS), integrated solution ICs, semiconductor components and wafer foundry services. The Company's integrated solution ICs includes integrated ambient lights, proximity sensor modules, infrared light emitting diode (LED) and others. The Company's semiconductor components include discrete, analog ICs, sensor ICs and others. The Company's products and services are mainly applied in the power supply of computer, communication and consumer electronic (3C), industrial, lighting, automobile and other industries. The Company distributes its products primarily in Asia, Europe and the Americas.

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