NanoFocus AG has developed the fastest confocal sensor in the world for 3D quality control that is directly integrated into production processes. It inspects complex microelectronic, micromechanical, mechatronic and optical products and components. The HICOS3D sensor (high-speed confocal sensor for 3D) is especially well-suited for use in the field of semiconductors and opens up new opportunities on the market for NanoFocus. The HICOS3D is being presented for the first time at the SEMICON Taiwan. The new confocal high-speed sensor delivers over five million 3D measurement points per second and thus more than fulfils the goal set at the time of the project start: producing the fastest confocal sensor in the world. The HICOS3D offers lateral and axial resolutions that are four times higher than the fastest confocal sensor that existed when the project began. At the same time, NanoFocus increased the measurement speed by 2.5 times. The requirements placed on the measurement technology used in microelectronics are continually increasing in light of increasing performance and simultaneous miniaturisation. Due to the quickly increasing integration density needed for constructing modern smartphones, tablet PCs and other mobile devices, the diameter of electronic connection contacts (bumps) have now decreased to under 30 -m. This trend will continue and create great challenges for the inspection systems for the bumps used in microelectronics in the future where precision and speed are concerned. With the HICOS3D, NanoFocus can make an important contribution to mastering these challenges.