Samsung Electro Mechanics : Annual Executive Appointments for 2024
November 29, 2023 at 07:52 pm EST
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Press Release2023.11.29
Samsung Electro-Mechanics Annual Executive Appointments for 2024
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Samsung Electro-Mechanics today announced its 2024 annual executive appointments. A total of eight people were promoted, including two Executive Vice Presidents and six Vice Presidents.
By selecting core talents from each unit, including R&D, manufacturing, facility technology, sales, and business management, Samsung Electro-Mechanics has strengthened the leadership that will be the main pillar of future growth through constant challenge and innovation, and is expanding diversity within the organization by appointing female executives for the second year in a row.
In the MLCC/Camera Module unit, Samsung Electro-Mechanics promoted and selected talented individuals to lead cutting-edge product development, and in the Package unit, the company promoted and selected talented individuals to lead productivity innovation for package substrates, focusing on core talents who can lead the expansion of the business.
Samsung Electro-Mechanics concluded its regular executive appointments today and will soon be conducting reorganizations and assignments to new positions.
[List of promotions]
■ Promoted to Executive Vice President (2 persons)
PARK SEON - CHEOL (박선철) AN BYUNG - GI (안병기)
■ Promoted to Vice President (6 persons)
KANG SUNG - HYUNG (강성형) PARK KYU - TAECK (박규택) BAN YOUNG -MIN (반영민)
CHO JAE - CHOON (조재춘) HEO MOON - SEOK (허문석) HEO SOO -YEONG (허수영)
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Samsung Electro-Mechanics Co. Ltd. published this content on 29 November 2023 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 30 November 2023 00:51:13 UTC.
Samsung Electro-Mechanics Co Ltd is a Korea-based company mainly engaged in the manufacture and distribution of electronic components. The Company operates its business through three segments. The Component Solution segment is involved in the production and sale of passive elements such as multi layers ceramic capacitors (MLCC), inductors, chip resistors. The Module Solution segment is involved in the production and sale of module products, including camera modules and communication modules. The Board Solution segment is involved in the production and sale of semiconductor package substrates and high-density multilayer boards. The Company distributes its products in domestic and overseas markets such as America, Europe and Southeast Asian countries, China and Japan.
SAMSUNG ELECTRO-MECHANICS CO., LTD. 
