Infineon Technologies AG and Schweizer Electronic AG are collaborating on an innovative way to further increase the efficiency of chips based on silicon carbide (SiC). Both partners are developing a solution to embed Infineon's 1200 V CoolSiCT chips directly onto printed circuit boards (PCB). This will increase the range of electric vehicles and reduce the total system costs.

Infineon and SCHWEIZER will showcase the 1200 V CoolSiC chip embedding technology at PCIM Europe 2023 in Nuremberg, at the Infineon booth 412 in Hall 7. SCHWEIZER will also be at the trade fair (booth 410 in Hall 6).