SEALSQ Corp. announced its plan to establish an Open Semiconductors Assembly and Test (?OSAT?) Center in the United States (?US?). The US-based OSAT would provide testing services such as the wafer test and final test, in addition to assembly services such as QFN, BGA, WLCSP, and more.

The initiative encompasses the development of Semiconductor Personalization Centers through Public-Private Partnerships (PPP). SEALSQ is currently in negotiation for three major projects in Europe, the Middle East, and the Far East to implement similar processes, run by experienced hardware designers to create the chip design using RISC-V technology. The chips will still be built locally at the SEALSQ centers, ensuring they meet the security standards and certifications from bodies such as Common Criteria and NIST.

The US-based OSAT will focus on the SEALSQ (Semiconductor, Efficient Architecture for Long-term Security Quantum) semiconductors, post-quantum cryptography, and artificial intelligence (AI), having the potential to herald a transformative era for semiconductor technology. This delves into the technical underpinnings and potential impacts of this integration, exploring how it paves the way for a new generation of semiconductors that are poised to redefine security, efficiency, and intelligence in digital systems.