Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg and Purdue University President Mung Chiang joined federal partners and executives of South Korea-based SK hynix Inc., the world?s leading producer of High-Bandwidth Memory (HBM) chips, as the company announced plans to establish a new advanced packaging fabrication and R&D facility for high-intensity and AI microelectronic products and applications in Indiana. SK hynix?s multi-billion-dollar investment is the first of its kind in the U.S. and is expected to drive innovation and fill a critical gap in the nation?s advanced packaging supply chain while creating up to 800 new, high-wage jobs by the end of 2030. SK hynix will make an initial investment of more than $3.87 billion to establish a 430,000-square-foot facility on 90 acres at the Purdue Research Park in West Lafayette to support critical U.S. demand for semiconductors.

The new facility will be home to an advanced semiconductor packaging production line that will mass produce next generation HBM, the highest-performing Dynamic Random Access Memory (DRAM) chips, which are the critical components of graphic processing units (GPUs) that train AI systems. The facility will also develop future generations of chips and house an advanced packaging R&D line. By the end of 2030, SK hynix expects to create hundreds of highly skilled jobs in areas of engineering, technical support, administrative and maintenance operations. SK hynix selected the West Lafayette site due to Indiana?s resilient manufacturing infrastructure, its robust talent and R&D ecosystem, and the strong support provided by the state and local governments.

The company?s new initiative is a significant win for the Midwest and for U.S. national security.