SHI becomes a silver sponsor for the Electronic Components and Technology Conference (ECTC)
April 15, 2024 at 08:17 am EDT
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Sumitomo Heavy Industries, Ltd. (SHI; Head Office: Shinagawa-ku, Tokyo; President and CEO: Shinji Shimomura; hereinafter 'SHI') has become a silver sponsor for the 'Electronic Components and Technology Conference (ECTC).
ECTC is an internationally significant conference in the field of semiconductor manufacturing technology.
Through this sponsorship, SHI aims to contribute to the development of the semiconductor industry.
About ECTC
The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is organized by the IEEE Electronics Packaging Society (former CPMT).
Sumitomo Heavy Industries, Ltd. specializes in the design, manufacturing and marketing of industrial and construction equipment. Net sales break down by family of products as follows:
- construction equipment (29.3%): hydraulic excavators, cranes, road machinery, etc.;
- precision machinery (20.8%): molding machines by injection, electric injection molding machines, medical use cyclotrons, etc.;
- equipment for environment protection (19.8%): energy generators, industrial wastewater processing systems, air pollution control units, etc.;
- machinery components (14.4%): power transmission and control systems (gears, power inverters, geared motors, gearboxes, etc.), motors, mechanical coupling systems, etc.;
- industrial equipment (11%): handling systems, logistic equipment, gas turbines, pumps, etc.;
- ships (4%);
- other (0.7%).
SUMITOMO HEAVY INDUSTRIES, LTD. 
