THine Has Working Samples of V-by-One®US Chip Set Ready
September 20, 2018
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THine Electronics, Inc. announced that the LSI chipset conforming V-by-One®US Standard is working and its samples are available for limited collaborating customers. This chipset transmits 8K data with 687-billion-color depth through 1-meter FFC and high resolution displays can be drastically simpler, thinner and stylisher with designing flexibility and manufacturing yield advantages with V-by-One®US technology. Typically, 8K TVs with this technology can use the same number of cables for internal interface as 4K. THine has released V-by-One®US Standard that supports up to 16Gbps, 4 times faster than V-by-One®HS which is now de-facto-standard internal interface for 4K displays, introduced by THine to solve critical problems of digital video data transmission such as EMI, dynamic frequency range, length/number of cables and connectors, and manufacturing yield rate. The new chipset converts data between 8-lane V-by-One®HS and 2-lane V-by-One®US, covering one 4K60Hz display or four 1080p displays. Display requirements, such as resolution, frame rate, and color depth, have kept pushing for better user experience, and 8K displays are known to be around the corner. Applications of this chipset include 4K/8K displays, inflight entertainment, interactive displays/whiteboards, digital signage displays with multiple modules, gaming (multiple) monitors, and VR/MR devices.
THine Electronics, Inc. is a Japan-based company primarily engaged in the large scale integration (LSI) business and artificial intelligence and Internet of Things (AIOT) business. The Company has two business segments. The LSI segment is engaged in the development and sale of flat panels and other mixed signal LSI products for office equipment, amusements, security cameras, in-vehicle equipment, flat screen televisions, liquid crystal panels, personal computers and other fields, as well as the intellectual property (IP) licensing business through products development. The AIOT segment is engaged in the development, manufacture and sale of hardware and software for artificial intelligence (AI), Internet of Things (IoT) and machine-to-machine (M2M) devices, and mobile communication devices.