TTM Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended October 02, 2023
November 01, 2023 at 08:00 am EDT
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TTM Technologies, Inc. reported earnings results for the third quarter and nine months ended October 02, 2023. For the third quarter, the company reported sales was USD 572.58 million compared to USD 671.08 million a year ago. Net loss was USD 37.07 million compared to net income of USD 43.53 million a year ago. Basic loss per share from continuing operations was USD 0.36 compared to basic earnings per share from continuing operations of USD 0.43 a year ago. Diluted loss per share from continuing operations was USD 0.36 compared to diluted earnings per share from continuing operations of USD 0.42 a year ago.
For the nine months, sales was USD 1,663.53 million compared to USD 1,877.89 million a year ago. Net loss was USD 36.06 million compared to net income of USD 88.57 million a year ago. Basic loss per share from continuing operations was USD 0.35 compared to basic earnings per share from continuing operations of USD 0.87 a year ago. Diluted loss per share from continuing operations was USD 0.35 compared to diluted earnings per share from continuing operations of USD 0.85 a year ago.
TTM Technologies, Inc. is a global manufacturer of technology solutions including mission systems, radio frequency (RF) components and RF microwave/microelectronic assemblies, and quick-turn and technologically advanced printed circuit boards (PCB). The Company's segments include PCB, and RF and Specialty Components (RF&S Components). The PCB segment consists of approximately 16 domestic system, sub-system, and PCB plants; four PCB fabrication plants in China; one in Malaysia, and one in Canada. The RF&S Components segment consists of one domestic RF component plant and one RF component plant in China. Each segment operates predominantly in the same industries with facilities that produce customized products for its customers and use similar means of product distribution. It offers a range of engineered systems, RF and microwave assemblies, high density interconnect (HDI) PCBs, rigid-flex PCBs, custom assemblies and system integration, integrated circuit (IC) substrates and others.
TTM TECHNOLOGIES, INC. 
