Taiwan S.E.
06:00:00 2024-05-06 pm EDT
5-day change
1st Jan Change
122.5
TWD
-0.81%
-5.77%
-21.73%
VIA Technologies, Inc. Announces Dividend Payable on September 17, 2021
July 20, 2021 at 02:08 am EDT
VIA Technologies, Inc. announced a dividend of TWD 0.80 per share. Ex-dividend is on August 19, 2021 and record date is on August 26, 2021. The cash dividend is scheduled to be distributed on September 17, 2021.
VIA Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2023
Mar. 14
CI
VIA Technologies, Inc. announced that it expects to receive TWD 300 million in funding
Mar. 05
CI
VIA Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2023
Nov. 09
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VIA Technologies, Inc. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2023
23-08-09
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VIA Technologies, Inc. Announces the Appointment of Kou-Sheng Tseng as Member of Compensation Committee
23-08-03
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VIA Technologies, Inc. Announces Audit Committee Changes
23-06-16
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VIA Technologies, Inc. Announces Executive Changes
23-06-16
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VIA Technologies, Inc. Reports Earnings Results for the First Quarter Ended March 31, 2023
23-05-10
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VIA Technologies, Inc. Announces Cash Dividend, Payable on July 19, 2023
23-05-05
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VIA Technologies, Inc. Announces Resignation of Wen-Yuen Ken as Member of Audit Committee / Compensation Committee, Effective June 15, 2023
23-03-09
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Via Technologies, Inc. Announces Resignation of Wen-Yuen Ken as Independent Director, Effective June 15, 2023
23-03-09
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VIA Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2022
22-10-31
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VIA Technologies, Inc. Reports Earnings Results for the Second Quarter and Six Months Ended June 30, 2022
22-08-03
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VIA Technologies, Inc. Reports Earnings Results for the First Quarter Ended March 31, 2022
22-05-03
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VIA Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2021
22-03-10
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VIA Technologies, Inc. Announces for Cash Dividend
22-03-08
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VIA Technologies, Inc. Reports Earnings Results for the Third Quarter and Nine Months Ended September 30, 2021
21-11-03
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Ennoconn Corporation announced that it has received TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc. and another investor
21-08-22
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Ennoconn Corporation announced that it expects to receive TWD 1.5 billion in funding from VIA Labs, Inc., MediaTek Capital Co., VIA Technologies, Inc.
21-08-10
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Via Technologies, Inc. Reports Earnings Results for the Second Quarter Ended June 30, 2021
21-07-29
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VIA Technologies, Inc. Announces Dividend Payable on September 17, 2021
21-07-20
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Via Technologies, Inc. Reports Earnings Results for the First Quarter Ended March 31, 2021
21-04-28
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Via Technologies, Inc. Reports Earnings Results for the Full Year Ended December 31, 2020
21-03-21
CI
Intel Not Inside : How Mobile Chips Overtook the Semiconductor Giant
20-12-12
DJ
Via Technologies, Inc. Reports Earnings Results for the Third Quarter Ended September 30, 2020
20-11-12
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Duration Auto. 2 months 3 months 6 months 9 months 1 year 2 years 5 years 10 years Max.
Period Day Week
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VIA Technologies, Inc. is a Taiwan-based company principally engaged in the design, research, development, manufacture and distribution of chips. The Companyâs products include central processing unit, logic chip, embedded control platform solution, Low-power multi-function system chip, x86 processor, multimedia control chip, digital electronic board player, industrial control fan-free system, Tablet PC, embedded module and peripheral accessories. The Company distributes its products within domestic market and to overseas markets.
More about the company
1st Jan change
Capi.
-21.73% 1.91B +2.96% 50.96B -17.39% 14.73B +23.79% 11.95B +47.29% 8.78B +3.41% 8.67B +23.21% 8.51B -8.02% 8.36B -10.22% 7.14B -13.11% 6.93B
Integrated Circuits
+951% of historical
More than 20 years
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