TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LIMITED
Hsinchu, Taiwan, R.O.C., August 8, 2017 -
TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which approved capital appropriations of approximately US$3,153.6 million for purposes including: 1) Construction of fab facilities for US$528 million; 2) Other purposes for US$2,625.6 million including: Expanding and upgrading advanced technology equipment; Expanding advanced packaging technology capacity; Upgrading specialty technology capacity; Conversion of logic capacity to specialty technology; Fourth quarter 2017 R&D capital investments and sustaining capital expenditures.
TSMC (NYSE: TSM) today held a meeting of the Board of Directors, which approved capital appropriations of approximately US$3,153.6 million for purposes including: 1) Construction of fab facilities for US$528 million; 2) Other purposes for US$2,625.6 million including: Expanding and upgrading advanced technology equipment; Expanding advanced packaging technology capacity; Upgrading specialty technology capacity; Conversion of logic capacity to specialty technology; Fourth quarter 2017 R&D capital investments and sustaining capital expenditures.
TSMC - Taiwan Semiconductor Manufacturing Company Ltd. published this content on 08 August 2017 and is solely responsible for the information contained herein.
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