INVESTOR PRESENTATION

March 2024

Safe Harbor Statement

This presentation contains statements about management's future expectations, plans and prospects of our business that constitute forward-looking statements, which are found in various places throughout the presentation, including, but not limited to, statements relating to expectations of orders, net sales, product shipments, expenses, timing of purchases of assembly equipment by customers, gross margins, operating results and capital expenditures. The use of words such as "anticipate", "estimate", "expect", "can", "intend", "believes", "may", "plan", "predict", "project", "forecast", "will", "would", and similar expressions are intended to identify forward looking statements, although not all forward-looking statements contain these identifying words. The financial guidance set forth under the heading "Outlook" contains such forward-looking statements. While these forward looking statements represent our judgments and expectations concerning the development of our business, a number of risks, uncertainties and other important factors could cause actual developments and results to differ materially from those contained in forward looking statements, including any inability to maintain continued demand for our products; failure of anticipated orders to materialize or postponement or cancellation of orders, generally without charges; the volatility in the demand for semiconductors and our products and services; the extent and duration of the COVID-19 pandemic and measures taken to contain the outbreak, and the associated adverse impacts on the global economy, financial markets, global supply chains and our operations as well as those of our customers and suppliers; failure to develop new and enhanced products and introduce them at competitive price levels; failure to adequately decrease costs and expenses as revenues decline; loss of significant customers, including through industry consolidation or the emergence of industry alliances; lengthening of the sales cycle; acts of terrorism and violence; disruption or failure of our information technology systems; consolidation activity and industry alliances in the semiconductor industry that may result in further increased customer concentration, inability to forecast demand and inventory levels for our products; the integrity of product pricing and protection of our intellectual property in foreign jurisdictions; risks, such as changes in trade regulations, conflict minerals regulations, currency fluctuations, political instability and war, associated with substantial foreign customers, suppliers and foreign manufacturing operations, particularly to the extent occurring in the Asia Pacific region where we have a substantial portion of our production facilities, potential instability in foreign capital markets; the risk of failure to successfully manage our diverse operations; any inability to attract and retain skilled personnel, including as a result of restrictions on immigration, travel or the availability of visas for skilled technology workers as a result of the COVID-19 pandemic; those additional risk factors set forth in Besi's annual report for the year ended December 31, 2023 and other key factors that could adversely affect our businesses and financial performance contained in our filings and reports, including our statutory consolidated statements. We expressly disclaim any obligation to update or alter our forward-looking statements whether as a result of new information, future events or otherwise.

March 2024

2

Agenda

  1. Company Overview
  1. Market Overview

III. End-User Market Trends

IV. Strategy

  1. Financial Update and Summary VI. Appendix

March 2024

3

I. COMPANY OVERVIEW

March 2024

4

Besi Overview

Corporate Profile

Financial Highlights*

Investment

Considerations

March 2024

  • Leading assembly equipment supplier with #1 and #2 positions in key markets
    • ~30%+ addressable market share
  • Broad portfolio: die attach, packaging and plating
  • Strategic positioning in substrate and wafer level packaging
  • ~75% of systems used for advanced packaging applications
  • Global operations in 7 countries; 1,736 employees. HQ in the Netherlands
  • 2023 revenue and net income of € 578.9 million and € 177.1 million
  • Cash/deposits: € 413.5 million
  • Net cash/deposits: € 113.0 million
  • € 1.9 billion dividends/share repurchases since 2011 including 2023 dividend
  • Leading position in advanced packaging. Ever more critical part of semi value chain
  • Peer leading financial metrics
  • Multiple growth drivers: Digital and cloud infrastructure build, smart everything, AI, 5G, vehicle electrification and autonomous driving
  • Hybrid bonding and wafer level assembly can significantly expand revenue and profit potential
    • As of December 31, 2023

5

Company History

700

600

500

millions)

400

(€

Revenue

300

200

€ 85.5

100

25.9%

0

2003

Consistent focus on Advanced Packaging has created an industry leader

  • Focus on most rapidly growing segments of assembly market
  • Growth organically and via acquisitions
  • Expanded share of wallet with key industry leaders each cycle
  • Expansion of customer base, particularly in Asia
  • Development of hybrid bonding/wafer level assembly portfolio can expand addressable market and share

Successful Die Attach acquisitions aided growth

Strategic plan initiatives enhanced business model

  • Asian production transfer enhanced efficiency, revenue and profits
  • Asian production hubs (MY, CN and VN), Singapore development/support center and Asian supply chain expanded global reach
  • Scalability improved. Break even revenue levels reduced

Peer leading financial metrics achieved

  • Step function revenue growth through cycles
  • Financial returns in upper quartile of all semi equipment companies
  • Attractive capital allocation policy

Revenue

Gross Margin

€ 578.9

64.9%

2023

70%

60%

50%

40%

30%

20%

March 2024

6

History of Superior Long-Term Value Creation

Capital Allocation

Attractive capital

allocation program

  • 1.9 billion of dividends and share repurchases since 2011*

Represents ~30% of total

revenue

Strategic/Financial

Disciplined execution has

created leader in

advanced packaging

Best in class financial

metrics

Superior through cycle financial performance versus peers

Shareholder Return

Superior Total Returns**:

150% (1 year)

210% (3 year)

812% (5 year)

Consistent TSR

outperformance versus

peers

Upper quartile ranking for

all semi-equipment

companies

  • Includes share repurchases through December 31, 2023, and proposed 2023 dividend for approval at 2024 AGM
  • Through December 31, 2023

March 2024

7

Industry Leading Equipment Portfolio

Die Attach (77% of 2023 Revenue)

Multi-Module Attach

Epoxy / Soft Solder

Direct Lid

Embedded

Thermo

Hybrid

Flip-chip

Compression

Attach

Bridge Attach

Bonding

2200 evo

2100 hS

2009 SSI

8800 CHAMEO advanced / PLP

New

2200 evo plus

2100 hS i

2100 SSI

8800 CHAMEO

ultra

8800 TC advanced

New

2200 evo hS

2100 sD advanced i

8800 FC Quantum adv / sigma

• DLA

(Chip to Substrate)

• 8800 CHAMEO ultra plus

8800 FC Quantum hs

• TGB 2.0

New

• DBA

New

2200 evo advanced

2100 hS ix

9800 TC NEXT

• 8800 CHAMEO ultra plus AC

2100 FC hS

(Chip to Wafer)

New

2200 evo hf

Q1-23

New

Packaging & Plating (23% of 2023 Revenue)

Leadframe Molding

Substrate Molding

Wafer & Panel Molding

AMS-i

AMS-X

New

AMS-LM

FML

• MEMS

• HD Leadframe

• Substrate strip format

• Wafer molding

• Sensors

• Power Devices

• Exposed die

• Panel molding

• SIP packages

New

March 2024

Trim and Form

Singulation

FCL-X/P

FSL

• Leadframe trim & form

• Substrate strip

• Sorting

singulation

• AGV handling

• Sorting

• IGBT handling

• Stepcut

New

Plating

  • Leadframe
  • Power Modules New
  • Film & Foil
  • Chemical Deflash
  • Wettable Flank New
  • Flux cleaning New

8

Customer Ecosystem

Customers

OEMs

End Products

IDMs

Subcontractors

  • Diversified, blue chip customer base, top 10 = ~52% of 2023 revenue
  • Leading IDMs and subcontractors. 52%/48% order split in 2023
  • Also supply leading fabless companies: Qualcomm, AMD, Nvidia, Broadcom, MediaTek via subcontractors
  • Long term relationships, some exceeding 50 years

March 2024

9

From Processed Wafer to Assembled Chip

Semiconductor Manufacturing Equipment

2023E: $109.0B*

Front end: $98.0B

Assembly: $4.1B

Test: $6.9B

(90%)

(4%)

(6%)

Assembly Process

Dicing

Die Attach

Wire Bond

Packaging

Plating

* Source: TechInsights, December 2023

March 2024

Leadframe

Wire Bond

Substrate

Wire bond

Substrate

Flip chip/TCB

Wafer Level

Hybrid, EMIB, TCB, Flip Chip, FOWLP

10

Attachments

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Disclaimer

BE Semiconductor Industries NV published this content on 04 March 2024 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 05 March 2024 10:28:06 UTC.