Ceva, Inc. launched Ceva-Waves Links a new family of multi-protocol wireless platform IPs. The integrated offering supports the latest wireless standards to address the surging demand for connectivity-rich chips targeting Smart Edge devices in the consumer IoT, Industrial, automotive, and personal computing markets. These IPs include Wi-Fi, Bluetooth, Ultra-Wideband (UWB), and IoT 802.15.4, to offer a range of qualified, easy-to-integrate, multi-protocol wireless communications subsystems, each featuring optimized co-existence schemes and adapted to various radar and configurations.

The Links family leverages the newly rebranded Ceva-Waves portfolio of wireless connectivity IPs, formerly known as RivieraWaves. Ceva-Waves Links100, an integrated, low power, Wi-Fi 6 /Bluetooth 5.4 /802.15.4 communications subsystem IP for IoT applications is the first IP available in this family and is currently being deployed by a leading OEM customer. The demand for smaller, low-cost, high-performing, innovative devices with versatile connectivity is driving the need to consolidate multiple connectivity protocols in a single chip.

ABI Research reflects on the move from module-level integration to on-die chip integration and forecasts that Wi-Fi plus Bluetooth combo chipset shipments will approach 1.6 billion chips annually by 2028. Upcoming Links platforms may include: Advanced Wi-Fi 6/6E/7 with MLO, for a variety of use-cases, from power-efficient IoT to high-speed data streaming; Next generation Bluetooth for Channel Sounding and High Data Throughout; UWB, supporting FiRa 2.0, CCC Digital Key 3.0, and Radar, for innovative micro-location and sensing features; Optimized co-existence schemes for each specific configuration; Pre-integrated radio solutions, including partner and customer's own technology, to address a wide range of configurations and foundry process nodes.