Coherent Corp. announced it has established the capability for 6-inch indium phosphide (InP) wafer fabrication, in the company?s Sherman, Texas, and Järfälla, Sweden, wafer fabs. This exciting milestone enables Coherent to increase production capacity and lower die costs for InP optoelectronic devices, widely used in applications such as coherent optical communications, datacom transceivers, AI interconnects, advanced sensing for consumer electronics and wearables, medical and automotive applications, and, in the future, in 6G wireless and satellite communications networks.
Coherent is in the process of qualifying several existing products on its 6-inch InP platform, including a 200G electro-absorption modulated laser (EML), 200G distributed-feedback laser and Mach-Zehnder modulator (DFB-MZ), 100G EML, high-speed photodetectors, and high-power CW lasers for silicon photonics applications. The company expects to transition the bulk of its production from 3-inch InP to 6-inch InP in the next few years to fully leverage the benefits of larger wafer size, higher yield, and improved performance that will be required to provide a sustainable competitive advantage in its communications and sensing markets.