Himax Technologies, Inc. announced it has entered a Memorandum of Understanding (MOU) for Strategic Cooperation with Nexchip Semiconductor Corporation (?Nexchip?) for the supply of ICs for automotive display market, in response to escalating demand for automotive displays across the industry. Mr. Chen Ping-Po, Executive Vice President of Automotive Display and Touch Operation Unit at Himax, signed the MOU on behalf of the Company at Nexchip?s new factory inauguration ceremony located in Hefei, China.By entering the automotive area, the partnership of Himax and Nexchip takes a significant stride forward in addition to the existing successful collaboration in consumer electronic products over the past several years. The collaboration illustrates Himax?s foundry supply diversification strategy to expand IC supply for the thriving automotive market and further strengthens the Company?s position in it.

The alliance also underscores both parties? undivided focus on the automotive market in the coming years, particularly in China. With the development of electric vehicles and automobile intelligence, the demand for displays in smart cockpits continues to increase and evolve towards large-size, high resolution, narrow bezel, curved, and touch integration displays.

Himax plays a critical role in enabling all these features. Widely recognized in the industry for its leadership position in automotive display IC market, Himax provides the broadest offerings in the industry, ranging from traditional DDIC to innovative technologies like TDDI, local dimming Tcon, LTDI and AMOLED. Collectively, the holistic product range offers a comprehensive one-stop-shop product portfolio, making Himax the go-to provider for automotive display solutions.