Infinera announced ICE-D, a new line of high-speed intra-data center optics based on monolithic indium phosphide (InP) photonic integrated circuit (PIC) technology. ICE-D optics are designed to dramatically lower cost and power per bit while providing intra-data center connectivity at speeds of 1.6 terabits per second (Tb/s) and greater. This technology enables data center operators to cost-effectively keep pace with relentless growth in bandwidth.

Driven by AI workloads and switched network applications, market demand for high-speed (800G+), immediate-reach (100+ meters) intra-data center interconnect technology is projected to grow nearly tenfold over the next four years - from about 300,000 units in 2023 to more than 2.5 million units by 2027, with a total market opportunity of greater than $2.2 billion, according to industry analysts at Cignal AI. Leveraging the unique capabilities of Infinera's U.S.-based optical semiconductor fab, Infinera's intra-data center optical connectivity technology enables highly integrated solutions that combine multiple optical functions onto a single monolithic chip, resulting in density, low latency, and power efficiency. ICE-D test chips are currently available and have demonstrated a reduction in power per bit by as much as 75% while simultaneously increasing connectivity speed.

Infinera's flexible ICE-D intra-data center optics are designed to support integration into a variety of different intra- and campus data center optical solutions. These solutions include digital signal processor (DSP)-based retimed optics, linear-drive pluggable optics (LPO), and co-packaged optics (CPO) for both serial and parallel fiber applications and distances ranging from 100 meters up to 10 kilometers.