TOWA Corporation

6315

JP3555700008

Semiconductor Equipment & Testing

Delayed Japan Exchange Other stock markets 01:06:56 2024-05-17 am EDT			5-day change	1st Jan Change
13,440 ^JPY	+1.97%		+20.66%	+88.36%

Mar. 25	Towa Pharmaceutical Completes Payment for Director Stock Compensation	MT
Feb. 07	Towa Corporation Provides Dividend Guidance for the Year Ending March 31, 2024	CI

Towa Corporation Announced Year End Dividend for the Financial Year Ended March 31, 2023, Payable on June 8, 2023

May 11, 2023 at 02:30 am EDT

TOWA Corporation declared year end dividend of JPY 40.00 for the financial year ended March 31, 2023, against ¥50.00 per share paid a year ago. Dividend payable date (as planned) June 8, 2023.

Latest news about TOWA Corporation

Towa Pharmaceutical Completes Payment for Director Stock Compensation	Mar. 25	MT
Towa Corporation Provides Dividend Guidance for the Year Ending March 31, 2024	Feb. 07	CI
Towa Corporation Provides Earnings Guidance for the Year Ending March 31, 2024	Feb. 07	CI
Jefferies Adjusts Towa’s Price Target to 7,700 Yen From 6,200 Yen, Keeps at Buy	Nov. 21	MT
Jefferies Adjusts TOWA’s Price Target to 6,200 Yen From 5,000 Yen, Keeps at Buy	Nov. 09	MT
TOWA Corporation provides dividend guidance for the year ending March 31, 2024	Nov. 08	CI
TOWA Corporation provides consolidated earnings guidance for the year ending March 31, 2024	Nov. 08	CI
Towa Corporation Provides Dividend Guidance for the Year Ending March 31, 2024	23-08-08	CI
Towa Corporation Provides Consolidated Earnings Guidance for the Half Year Ending September 30, 2023, and Full Year March 31, 2024	23-08-08	CI
Towa Bank's FY23 Profit Soars 135%	23-05-22	MT
Jefferies Adjusts Towa’s Price Target to 3,000 Yen From 2,700 Yen, Keeps at Buy	23-05-16	MT
Towa Corporation Announced Year End Dividend for the Financial Year Ended March 31, 2023, Payable on June 8, 2023	23-05-11	CI
TOWA Corporation Provides Earnings Guidance for the Half Year Ending September 30, 2023, and Full Year March 31, 2024	23-05-11	CI
Towa Corporation Provides Dividend Guidance for the Year Ending March 31, 2024	23-05-11	CI
TOWA Corporation completed the acquisition of Mold Manufacturing Business of K-Tool Engineering.	23-04-29	CI
TOWA Corporation agreed to acquire Mold Manufacturing Business of K-Tool Engineering for MYR 30 million.	23-02-26	CI
Towa Corporation Provides Dividend Guidance for the Year Ending March 31, 2023	23-02-07	CI
TOWA Corporation Provides Consolidated Earnings Guidance for the Year Ending March 31, 2023	23-02-07	CI
TOWA Corporation Provides Consolidated Earnings Guidance for the Year Ending March 31, 2023	22-11-09	CI
TOWA Corporation Provides Dividend Guidance for the Year Ending March 2023	22-11-09	CI
TOWA Corporation Provides Consolidated Financial Guidance for the Six Months Ending September 2022 and Fiscal Year Ending March 2023	22-08-08	CI
TOWA Corporation Announces Dividend Guidance for the Full Year Ending March 31, 2023	22-08-08	CI
TOWA Corporation Provides Year End Dividend Guidance for the Financial Year Ended March 31, 2023	22-05-12	CI
TOWA Corporation Declares Year End Dividend for the Financial Year Ended March 31, 2022	22-05-12	CI
TOWA Corporation Provides Earnings Guidance for the Six Months Period Ending September 30, 2022; Fiscal Year Ending March 31, 2023	22-05-12	CI

TOWA CORPORATION is a Japan-based company mainly engaged in the manufacture and sale of precision molds for semiconductor manufacturing, semiconductor manufacturing equipment and fine plastic-molded parts. The Company operates in two business segments. The Semiconductor Manufacturing Equipment segment manufactures and sells semiconductor manufacturing precision molds, molding equipment and singulation equipment, among others. The Fine Plastic Moldings segment manufactures and sells medical equipment.

Sector

Semiconductor Equipment & Testing

Calendar

2024-08-07 - Q1 2024 Earnings Release (Projected)

More about the company

Income Statement Evolution

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Ratings for TOWA Corporation

Trading Rating

Investor Rating

ESG Refinitiv

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Analysts' Consensus

Sell

Buy

Mean consensus

OUTPERFORM

Number of Analysts

Last Close Price

13,180 JPY

Average target price

10,259 JPY

Spread / Average Target

-22.17%

Consensus

EPS Revisions

Estimates Revisions

Quarterly earnings - Rate of surprise

Company calendar

Sector Semiconductor Machinery Manufacturing

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Semiconductor Machinery Manufacturing