BoardTek Electronics Corp announced that it expects to receive TWD 1.2 billion in funding from Zhen Ding Technology Holding Limited

Zhen Ding Technology Holding Ltd provides solutions for the design, development, manufacturing, and sales of all types of printed circuit boards (PCB), including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), integrated circuit (IC) substrates, rigid-flex PCBs, chip-on-film (COF), and modules. FPC is used in smartphones, notebooks, smart wearable devices, and many other products. SLP is used for semiconductor packaging in manufacturing processes. COF are used in fingerprint-on-display modules, smart watch display modules, and high-resolution television and medical displays. Its applications include mobile phone, computer, wearable, augmented reality (AR) and virtual reality (VR), smart home, other consumer, data center, base station, networking, and automotive and industrial. It has five manufacturing campuses and over 20 sales offices in multiple locations.