Zhen Ding Technology : On Behalf of the Company's Subsidiary, Avary Holding (Shenzhen), to Announce the First Half of 2022 Financial Results Approved by the Board of Directors
On Behalf of the Company's Subsidiary, Avary
Holding (Shenzhen), to Announce the First Half of
2022 Financial Results Approved by the Board of Directors
Date of events
2022/08/09
To which item it meets
paragraph 51
Statement
1.Date of occurrence of the event:2022/08/09
2.Company name:Avary Holding (Shenzhen) Co., Limited
3.Relationship to the Company (please enter "head office" or
"subsidiaries"):Subsidiary
4.Reciprocal shareholding ratios:72.12%
5.Cause of occurrence:the Company's subsidiary, Avary Holding
(Shenzhen),announces the first half of 2022 financial results
approved by the board of directors
6.Countermeasures:On behalf of the Company's subsidiary to make
the announcement on MOPS in accordance with regulations
7.Any other matters that need to be specified:
Avary's first half of 2022 unaudited financial results as follows:
(1)Consolidated revenue was 14.19 billion RMB for 1H22, up 18.6%
compared to 11.96 billion RMB for 1H21.
(2)Net profit was 1.43 billion RMB for 1H22, up 125.2%
compared to 0.63 billion RMB for 1H21.
(3)EPS was 0.61 RMB for 1H22, up 125.9% compared to
0.27 RMB for 1H21.
(4)The announcement of 1H22 unaudited financial results was not
audited by the CPA. Investors should be aware of potential risks
as the actual result may vary from the preliminary estimated result.
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Zhen Ding Technology Holding Ltd. published this content on 09 August 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 09 August 2022 09:35:03 UTC.
Zhen Ding Technology Holding Ltd provides solutions for the design, development, manufacturing, and sales of all types of printed circuit boards (PCB), including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), integrated circuit (IC) substrates, rigid-flex PCBs, chip-on-film (COF), and modules. FPC is used in smartphones, notebooks, smart wearable devices, and many other products. SLP is used for semiconductor packaging in manufacturing processes. COF are used in fingerprint-on-display modules, smart watch display modules, and high-resolution television and medical displays. Its applications include mobile phone, computer, wearable, augmented reality (AR) and virtual reality (VR), smart home, other consumer, data center, base station, networking, and automotive and industrial. It has five manufacturing campuses and over 20 sales offices in multiple locations.
Zhen Ding Technology : On Behalf of the Company's Subsidiary, Avary Holding (Shenzhen), to Announce the First Half of 2022 Financial Results Approved by the Board of Directors
ZHEN DING TECHNOLOGY HOLDING LIMITED 
