[Correction] The Major Resolutions of ZDT's
2022 Annual General Shareholders' Meeting
Date of events
2022/05/31
To which item it meets
paragraph 18
Statement
1.Date of the shareholders meeting:2022/05/31
2.Important resolutions (1)Profit distribution/ deficit
compensation:
Acknowledged the distribution of 2021 profit
Cash dividend of NTD 5 per common share
Votes in favor:654,857,979 votes;
Votes against:117,918 votes;
Votes invalid/abstained:103,580,334 votes;
The resolution was ratified by 86.32% of the total represented shares.
3.Important resolutions (2)Amendments to the corporate charter:
Votes in favor:653,832,397 votes;
Votes against:183,687 votes;
Votes invalid/abstained:104,540,147 votes;
The resolution was ratified by 86.19% of the total represented shares.
4.Important resolutions (3)Business report and financial statements:
Acknowledged the 2021 Business Report and Financial Statements.
Votes in favor:654,116,929 votes;
Votes against:83,116 votes;
Votes invalid/abstained:104,356,186 votes;
The resolution was ratified by 86.23% of the total represented shares.
5.Important resolutions (4)Elections for board of directors and
supervisors:None
6.Important resolutions (5)Any other proposals:
(1)Approved amendments to the "Procedures for Acquisition and
Disposal of Assets"
Votes in favor:653,796,454 votes;
Votes against:220,562 votes;
Votes invalid/abstained:104,539,215 votes;
The resolution was ratified by 86.18% of the total represented shares.
7.Any other matters that need to be specified:None
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Zhen Ding Technology Holding Ltd. published this content on 31 May 2022 and is solely responsible for the information contained therein. Distributed by Public, unedited and unaltered, on 31 May 2022 09:09:07 UTC.
Zhen Ding Technology Holding Ltd provides solutions for the design, development, manufacturing, and sales of all types of printed circuit boards (PCB), including flexible circuit boards (FPC), substrate-like PCBs (SLP), high-density interconnect (HDI) PCBs, rigid printed circuit boards (RPCB), integrated circuit (IC) substrates, rigid-flex PCBs, chip-on-film (COF), and modules. FPC is used in smartphones, notebooks, smart wearable devices, and many other products. SLP is used for semiconductor packaging in manufacturing processes. COF are used in fingerprint-on-display modules, smart watch display modules, and high-resolution television and medical displays. Its applications include mobile phone, computer, wearable, augmented reality (AR) and virtual reality (VR), smart home, other consumer, data center, base station, networking, and automotive and industrial. It has five manufacturing campuses and over 20 sales offices in multiple locations.
ZHEN DING TECHNOLOGY HOLDING LIMITED 
