ChipMOS TECHNOLOGIES INC. Reports Unaudited Consolidated Revenue Results for the Month and Fourth Quarter Ended December 31, 2023

ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits (IC) packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. It mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.