ChipMOS Technologies Inc Approves Dividend for 2016; Appoints Leo Lin as the Head of Business Management Center

ChipMOS TECHNOLOGIES INC is a Taiwan-based company principally engaged in the integrated circuits (IC) packaging and testing business. The Company mainly provides thin small outline packaging (TSOP), fine-pitch ball grid array (FBGA) packaging, tape carrier packaging (TCP) and chip on film (COF) packaging services, as well as gold bumping services and others. The Company’s products and services are applied in information products, personal computers, communication equipment, office automation and consumer electronics. It mainly operates its businesses within domestic market and overseas markets, including the rest of Asia and the Americas.