Kulicke and Soffa Industries Explores Future M&A Opportunities
February 01, 2024 at 08:00 am EST
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Kulicke and Soffa Industries, Inc. (NasdaqGS:KLIC) is exploring future M&A opportunities. During the company?s 2024 first quarter results conference call, Lester A. Wong, Chief Financial Officer said that ?Finally, we are starting to see material opportunities in Advanced Dispense and continue to adopt an active, but cautious, posture in exploring future M&A opportunities?.
Kulicke and Soffa Industries, Inc. specializes in developing semiconductor and electronics assembly solutions. It designs, develops, manufactures, and sells capital equipment, consumables and services used to assemble semiconductors and electronic devices, such as integrated circuits, power discrete, light-emitting diode (LEDs), advanced displays and sensors. The Company operates in four segments. Its Ball Bonding Equipment segment is in designs, development, manufacture, and sell of ball bonding equipment and wafer level bonding equipment. Its Wedge Bonding Equipment segment is in design, development, manufacture, and sale of wedge bonding equipment. The Company's Advanced Solutions is in design, development, manufacture, and sells advanced display, die-attach and thermocompression systems and solutions. Its aftermarket products and services segment is in the design, development, manufacture and sale of a variety of tools, spares and services for the Company's equipment.