LASER TEK TAIWAN CO.,LTD. |
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|
5-day change | 1st Jan Change | ||
| 67.9 TWD | +0.44% |
|
-4.10% | +108.92% |
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| Sales 2022 | 1.39B 43.12M | Sales 2023 | 1.18B 36.62M | Capitalization | 2.46B 76.49M |
|---|---|---|---|---|---|
| Net income 2022 | 151M 4.69M | Net income 2023 | 147M 4.57M | EV / Sales 2022 | 1.68 x |
| Net Debt 2022 | 393M 12.23M | Net Debt 2023 | 396M 12.3M | EV / Sales 2023 | 2.42 x |
| P/E ratio 2022 |
14.3
x | P/E ratio 2023 |
17.9
x | Employees | - |
| Yield 2022 |
5.88% | Yield 2023 |
4.62% | Free-Float | 75.01% |
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| 1 day | +0.44% | ||
| 1 week | -4.10% | ||
| Current month | +7.78% | ||
| 1 month | +15.87% | ||
| 3 months | +93.72% | ||
| 6 months | +126.33% | ||
| Current year | +108.92% |
1 week
62.10
70.00
1 month
52.9077.00
Current year
31.2077.00
1 year
27.9077.00
3 years
24.8577.00
5 years
17.0577.00
10 years
17.0577.00
| Managers | Title | Age | Since |
|---|---|---|---|
Meng-Yi Huang
CEO | Chief Executive Officer | - | 05-06-30 |
Ching-Ling Tang
DFI | Director of Finance/CFO | - | 07-02-28 |
Hsueh Yi Hsiung
BRD | Director/Board Member | - | 13-06-17 |
| Members of the board | Title | Age | Since |
|---|---|---|---|
Chih Hsiang Chen
BRD | Director/Board Member | - | 01-07-13 |
Meng-Yi Huang
CEO | Chief Executive Officer | - | 05-06-30 |
Hsueh Yi Hsiung
BRD | Director/Board Member | - | 13-06-17 |
| Date | Price | Change | Volume |
|---|---|---|---|
| 24-05-17 | 67.9 | +0.44% | 7,777,347 |
| 24-05-16 | 67.6 | +4.32% | 10,372,170 |
| 24-05-15 | 64.8 | +3.68% | 9,802,862 |
| 24-05-14 | 62.5 | -4.73% | 8,571,552 |
| 24-05-13 | 65.6 | -4.65% | 7,879,576 |
End-of-day quote Taipei Exchange, May 16, 2024
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LASER TEK TAIWAN CO., LTD. is a Taiwan-based company principally engaged in the manufacturing and sales of passive components. The Company mainly operated through four business segments. The Surface Mounted Devices (SMDs) segment is mainly engaged in the manufacturing, processing and sales of passive components wafer packaging materials, active components plastic packaging materials and related electronic components and spare parts. The Equipment segment is mainly engaged in the sales and maintenance of testing equipment, optical equipment, printing equipment and related components of surface mount technology (SMT), as well as the research and development, manufacture and sales of laser applications equipment and parts. The Wafer Testing and Packaging segment is engaged in the testing and packaging of passive components wafers. The Others segment is mainly engaged in the sales of other electronic products and energy products.
Annual profits - Rate of surprise
| 1st Jan change | Capi. | |
|---|---|---|
| +108.92% | 159M | |
| +16.45% | 123B | |
| +42.90% | 110B | |
| +12.22% | 20.15B | |
| +8.08% | 19.69B | |
| +46.17% | 11.04B | |
| +31.18% | 9.81B | |
| -1.77% | 8.11B | |
| -24.81% | 6.09B | |
| +26.85% | 5.18B |
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