Wireless Glue Networks, Inc. announced that it has raised $4.5 million in its series B round of funding on February 21, 2013. The round included participation from Innovation Network Corporation of Japan, Takaoka Toko Holdings Co., Ltd., Hosiden Corp., Clean Pacific Ventures Management LLC, and INCJ, Ltd.

On February 21, 2013, Wireless Glue Networks, Inc. closed the transaction.